AMD EPYC 7601 Server Processor

AMD explicitly lists tray OPN PS7601BDVIHAF and boxed OPN PS7601BDAFWOF for the same EPYC 7601. These packaging ordering variants are not separate CPU models or SEO pages. Requested packaging and package contents require confirmation; neither identifier establishes current supply.

The 32-core 7601 combines 64 MB L3, a 2.2 GHz base clock and 180 W default TDP. Its 2.7 GHz all-core and 3.2 GHz maximum boost are distinct. AMD’s HPC guide uses this model to explain how active-core count and available headroom affect boost. An SP3 socket does not establish motherboard or server compatibility. Check the exact OEM supported CPU list, BIOS, DIMM population, power and cooling. No supported-server configuration is inferred from the socket name.

The model’s maximum DDR4 transfer rate is 2666 MT/s at one DIMM per channel (1DPC), subject to DIMM type, ranks, slot topology and OEM support. Eight memory channels are supported. Populate channels before adding a second DIMM per channel and balance memory across the selected sockets. The documented 2DPC population of 2400/2666-rated DIMMs operates at 2133 MT/s; do not assume the 1DPC maximum at every population. The 170.6 GB/s per-socket bandwidth specification is theoretical, not measured or sustained throughput. Default TDP is 180 W. Validate the exact OEM power and cooling design; a complete configurable TDP interval is Unknown. Up to 2 TB per CPU is an EPYC 7001 series-level ceiling, not a validated capacity for every OEM platform. AMD’s maximum-population example uses 16 x 128 GB LRDIMMs at 2DPC, 2133 MT/s and 136 GB/s theoretical bandwidth. The historical 4 TB figure is a dual-socket system total, not per CPU or a promise of simultaneous maximum capacity and maximum transfer rate.

Maximum boost is up to 3.2 GHz: the maximum frequency achievable by any single core under normal server operating conditions. AMD separately lists an all-core boost of 2.7 GHz in its March 2019 Table 1. Boost must be enabled and requires electrical and thermal headroom; neither value guarantees sustained frequency or application throughput.

An SP3 socket does not establish motherboard or server compatibility. Check the exact OEM supported CPU list, BIOS, DIMM population, power and cooling. No supported-server configuration is inferred from the socket name. PCIe Gen 3 x128 per CPU describes processor resources. It is not a promise of 256 exposed lanes in a dual-socket system; processor interconnect, routing and OEM implementation determine usable system I/O. The 7001 HPC guide describes four dies / NUMA nodes per socket with two memory channels per die. Memory locality, balanced population and workload placement matter; flat UMA behavior or a particular OEM tuning configuration is not promised.

Exact model launch date is Unknown. Current manufacturing, end-of-life, end-of-sale and commercial availability are Unknown. Current lifecycle is Unknown; accessible support pages and historical documents do not establish present supply. AMD’s June 20, 2017 announcement is a family event, not an assigned exact launch date for this processor.