AMD EPYC 7281 Server Processor
Procurement readiness
RFQ ReadyThe catalog record is approved for a standard quote request; current commercial terms still require RFQ review.
AMD EPYC 7281 is a 16-core, 32-thread EPYC 7001 Series processor with 32 MB L3 and a 2.1 GHz base clock for single- or dual-socket SP3 server platforms.
Quick Facts
- Cores
- 16
- Threads
- 32
- Base clock
- 2.1 GHz
- Default TDP
- 155 / 170 W
Highlights
- 16 cores / 32 threads with 32 MB L3
- 1P / 2P capability; 155 / 170 W default TDP
- 2400 / 2666 MT/s at 1DPC; DIMM / OEM conditions apply
- PCIe Gen 3 x128 per CPU; platform-dependent system lanes
Source-backed product identity
RFQ before payment
Order terms confirmed in quotation
Exact availability, condition, warranty, lead time and shipping scope are confirmed in the quotation.
Technical Specifications
Platform & Compute
The 16-core 7281 has 32 MB L3 and a 2.1 GHz base clock. An SP3 socket does not establish motherboard or server compatibility. Check the exact OEM supported CPU list, BIOS, DIMM population, power and cooling. No supported-server configuration is inferred from the socket name.
Platform & Compute
The 16-core 7281 has 32 MB L3 and a 2.1 GHz base clock. An SP3 socket does not establish motherboard or server compatibility. Check the exact OEM supported CPU list, BIOS, DIMM population, power and cooling. No supported-server configuration is inferred from the socket name.
| Model | EPYC 7281 |
|---|---|
| Architecture | Zen (14 nm) |
| Series | EPYC 7001 |
| Socket | SP3 |
| Socket count | 1P / 2P |
| Cores | 16 |
| Threads | 32 |
Performance & Capacity
Maximum boost is up to 2.7 GHz: the maximum frequency achievable by any single core under normal server operating conditions. AMD separately lists an all-core boost of 2.7 GHz in its March 2019 Table 1. Boost must be enabled and requires electrical and thermal headroom; neither value guarantees sustained frequency or application throughput.
Performance & Capacity
Maximum boost is up to 2.7 GHz: the maximum frequency achievable by any single core under normal server operating conditions. AMD separately lists an all-core boost of 2.7 GHz in its March 2019 Table 1. Boost must be enabled and requires electrical and thermal headroom; neither value guarantees sustained frequency or application throughput.
| Base clock | 2.1 GHz |
|---|---|
| Maximum boost | Up to 2.7 GHz (any single core; operating conditions apply) |
| All-core boost | Up to 2.7 GHz (boost enabled; electrical and thermal headroom required) |
| L3 capacity | 32 MB |
Memory
The model’s maximum DDR4 transfer rate is 2400 / 2666 MT/s at one DIMM per channel (1DPC), subject to DIMM type, ranks, slot topology and OEM support. Eight memory channels are supported. Populate channels before adding a second DIMM per channel and balance memory across the selected sockets. The documented 2DPC population of 2400/2666-rated DIMMs operates at 2133 MT/s; do not assume the 1DPC maximum at every population. The 153.6 / 170.6 GB/s per-socket bandwidth specification is theoretical, not measured or sustained throughput. Up to 2 TB per CPU is an EPYC 7001 series-level ceiling, not a validated capacity for every OEM platform. AMD’s maximum-population example uses 16 x 128 GB LRDIMMs at 2DPC, 2133 MT/s and 136 GB/s theoretical bandwidth. The historical 4 TB figure is a dual-socket system total, not per CPU or a promise of simultaneous maximum capacity and maximum transfer rate. The 7001 HPC guide describes four dies / NUMA nodes per socket with two memory channels per die. Memory locality, balanced population and workload placement matter; flat UMA behavior or a particular OEM tuning configuration is not promised.
Memory
The model’s maximum DDR4 transfer rate is 2400 / 2666 MT/s at one DIMM per channel (1DPC), subject to DIMM type, ranks, slot topology and OEM support. Eight memory channels are supported. Populate channels before adding a second DIMM per channel and balance memory across the selected sockets. The documented 2DPC population of 2400/2666-rated DIMMs operates at 2133 MT/s; do not assume the 1DPC maximum at every population. The 153.6 / 170.6 GB/s per-socket bandwidth specification is theoretical, not measured or sustained throughput. Up to 2 TB per CPU is an EPYC 7001 series-level ceiling, not a validated capacity for every OEM platform. AMD’s maximum-population example uses 16 x 128 GB LRDIMMs at 2DPC, 2133 MT/s and 136 GB/s theoretical bandwidth. The historical 4 TB figure is a dual-socket system total, not per CPU or a promise of simultaneous maximum capacity and maximum transfer rate. The 7001 HPC guide describes four dies / NUMA nodes per socket with two memory channels per die. Memory locality, balanced population and workload placement matter; flat UMA behavior or a particular OEM tuning configuration is not promised.
| Memory type | DDR4 |
|---|---|
| Supported channels | 8 |
| Transfer rate | 2400 / 2666 MT/s at 1DPC; DIMM / OEM conditions apply |
| Theoretical bandwidth per socket | 153.6 / 170.6 GB/s |
| Maximum capacity | Up to 2 TB per CPU (series-level ceiling; DIMM / OEM conditions apply) |
Expansion
PCIe Gen 3 x128 per CPU describes processor resources. It is not a promise of 256 exposed lanes in a dual-socket system; processor interconnect, routing and OEM implementation determine usable system I/O.
Expansion
PCIe Gen 3 x128 per CPU describes processor resources. It is not a promise of 256 exposed lanes in a dual-socket system; processor interconnect, routing and OEM implementation determine usable system I/O.
| PCIe generation | PCIe Gen 3 |
|---|---|
| Lanes per CPU | 128 |
Power & Cooling
The documented 155 / 170 W pair corresponds to 2400 / 2666 MT/s memory operation in Publication 56301. It is not an inferred continuous cTDP range. The OEM power and cooling design must support the chosen mode.
Power & Cooling
The documented 155 / 170 W pair corresponds to 2400 / 2666 MT/s memory operation in Publication 56301. It is not an inferred continuous cTDP range. The OEM power and cooling design must support the chosen mode.
| Default TDP | 155 / 170 W |
|---|---|
| Configurable TDP | Unknown; complete range not established |
Lifecycle
Exact model launch date is Unknown. Current manufacturing, end-of-life, end-of-sale and commercial availability are Unknown. Current lifecycle is Unknown; accessible support pages and historical documents do not establish present supply. AMD’s June 20, 2017 announcement is a family event, not an assigned exact launch date for this processor.
Lifecycle
Exact model launch date is Unknown. Current manufacturing, end-of-life, end-of-sale and commercial availability are Unknown. Current lifecycle is Unknown; accessible support pages and historical documents do not establish present supply. AMD’s June 20, 2017 announcement is a family event, not an assigned exact launch date for this processor.
| Exact model launch date | Unknown |
|---|---|
| Current manufacturing | Unknown |
| End of life | Unknown |
| End of sale | Unknown |
Procurement Identity
Use the base model and listed identifiers when building a multi-model RFQ. The selected PID, destination, configuration and commercial terms are confirmed before a quote is issued.
- Orderable part number
- PS7281BEVGAAF
- Orderable PID options
- PS7281BEVGAAF, PS7281BEAFWOF
- Lifecycle / commercial status
- Unknown
- Quote inputs
- PID or base model, quantity, destination and required configuration
Technical Documents
FAQ
Which ordering identifiers identify EPYC 7281?
AMD explicitly lists tray OPN PS7281BEVGAAF and boxed OPN PS7281BEAFWOF for the same EPYC 7281. These packaging ordering variants are not separate CPU models or SEO pages. Requested packaging and package contents require confirmation; neither identifier establishes current supply.
What distinguishes EPYC 7281 during platform selection?
The 16-core 7281 has 32 MB L3 and a 2.1 GHz base clock. An SP3 socket does not establish motherboard or server compatibility. Check the exact OEM supported CPU list, BIOS, DIMM population, power and cooling. No supported-server configuration is inferred from the socket name.
What memory population and power conditions apply to EPYC 7281?
The model’s maximum DDR4 transfer rate is 2400 / 2666 MT/s at one DIMM per channel (1DPC), subject to DIMM type, ranks, slot topology and OEM support. Eight memory channels are supported. Populate channels before adding a second DIMM per channel and balance memory across the selected sockets. The documented 2DPC population of 2400/2666-rated DIMMs operates at 2133 MT/s; do not assume the 1DPC maximum at every population. The 153.6 / 170.6 GB/s per-socket bandwidth specification is theoretical, not measured or sustained throughput. The documented 155 / 170 W pair corresponds to 2400 / 2666 MT/s memory operation in Publication 56301. It is not an inferred continuous cTDP range. The OEM power and cooling design must support the chosen mode. Up to 2 TB per CPU is an EPYC 7001 series-level ceiling, not a validated capacity for every OEM platform. AMD’s maximum-population example uses 16 x 128 GB LRDIMMs at 2DPC, 2133 MT/s and 136 GB/s theoretical bandwidth. The historical 4 TB figure is a dual-socket system total, not per CPU or a promise of simultaneous maximum capacity and maximum transfer rate.
Do all-core boost and maximum boost mean the same thing?
Maximum boost is up to 2.7 GHz: the maximum frequency achievable by any single core under normal server operating conditions. AMD separately lists an all-core boost of 2.7 GHz in its March 2019 Table 1. Boost must be enabled and requires electrical and thermal headroom; neither value guarantees sustained frequency or application throughput.
Does the CPU socket or lane count guarantee system compatibility?
An SP3 socket does not establish motherboard or server compatibility. Check the exact OEM supported CPU list, BIOS, DIMM population, power and cooling. No supported-server configuration is inferred from the socket name. PCIe Gen 3 x128 per CPU describes processor resources. It is not a promise of 256 exposed lanes in a dual-socket system; processor interconnect, routing and OEM implementation determine usable system I/O. The 7001 HPC guide describes four dies / NUMA nodes per socket with two memory channels per die. Memory locality, balanced population and workload placement matter; flat UMA behavior or a particular OEM tuning configuration is not promised.
Do historical announcements establish current availability?
Exact model launch date is Unknown. Current manufacturing, end-of-life, end-of-sale and commercial availability are Unknown. Current lifecycle is Unknown; accessible support pages and historical documents do not establish present supply. AMD’s June 20, 2017 announcement is a family event, not an assigned exact launch date for this processor.
RFQ
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Brand
AMD
Model
EPYC 7281
Product family
EPYC 7001 Series
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